arm: omap5: add U-Boot FIT signing and SPL image post-processing
Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS)
device variants to create a secure u-boot_HS.img FIT blob that contains
U-Boot and DTB artifacts signed with a TI-specific process based on the
CONFIG_TI_SECURE_DEVICE config option and the externally-provided image
signing tool.
Also populate the corresponding FIT image post processing call to be
performed during SPL runtime.
Signed-off-by: Daniel Allred <[email protected]>
Signed-off-by: Andreas Dannenberg <[email protected]>
Reviewed-by: Tom Rini <[email protected]>